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description the bd9300f/fv 1-channel dc/dc step-up, step-down, and inverting converter controller. this ic has a wide input voltage range of 3.6 to 35 v, providing for a variety of applications. the pin assignment is similar to that of the ba9700, facilitating a space-saving application. features 1) 1-channel pwm control dc/dc converter controller2) high voltage input of 3.6 to 35 v 3) reference voltage accuracy of 1% 4) oscillation frequency variable in the range of 20 to 800 khz 5) built-in uvlo (under voltage lock out) circuit and scp (short circuit prevention) circuit 6) current in standby mode: 0 a (typ.) 7) switching external synchronization available (slave operation)8) ssop-b14 package (for bd9300fv) or sop14 package (for bd9300f) applications . tv, power supply for liquid crystal display tv, and backlight . dsc, dvd, printer, dvd/dvd recorder, and other consumer products single-output step-up, negative voltage, step-down switching regulators (controller type) technical note bd9300f/bd9300fv large current external fet controller type switching regulators sep. 2008 input step-up voltage output step-up voltage application input inverting voltage output inverting voltage application input step-down voltage output step-down voltage application downloaded from: http:///
2/16 item symbol rating unit power supply voltage vcc 36 v power dissipation pd 400 mw operating temperature topr C40 to +85 ?c storage temperature tstg C55 to +125 ?c output current io 100 ma output voltage vo 36 v maximum junction temperature tjmax 125 ?c item symbol min typ max unit power supply voltage vcc 3.6 12 35 v output sink current i o C C 30 ma output voltage v o C C 35 v timing capacitance c t 33 C 1000 pf timing resistance rt 5 C 100 k oscillation frequency fosc 20 C 800 khz limits item symbol min t yp max unit conditions [reference voltage block]reference voltage v ref 2.475 2.500 2.525 v i ref =1ma input stability v dli C 1.5 20 mv vcc=3.6 to 35v load stability v dld C 0.5 20 mv i ref =0 ~ 1ma 1/2 reference voltage 1/2v ref 1.212 1.25 1.288 v [triangular wave oscillator block] oscillation frequency f osc 165 220 275 khz charge mode threshold voltage v osc + C 1.95 C v discharge mode threshold voltage v osc C C 1.45 C v frequency variation f dvo C 1 C % vcc=3.6 to 35v [protection circuit block]threshold voltage v it 1.5 1.8 2.1 v charge current iscp C 7 11 a [ rest period adjustment circuit block ] upper limit threshold voltage vt h 2.05 C C v duty cycle=0% lower limit threshold voltage vt l C C 1.35 v duty cycle=100% input bias current ibd C 0.1 1 a dtc=1.5v latch mode charge current idtc 200 500 C a dtc=0v [ under voltage lock out block ] threshold voltage v ut C 2.8 C v i ref =1ma limits absolute maximum ratings(ta=25?c) recommended operating range (ta=25?c) electrical characteristics (unless otherwise specified, ta=25?c, v cc =12v, ct=200pf, rt=20k ) * reduce by 4 mw/ ?c over 25?c, when mounted on a glass epoxy pcb of 70mmx70mmx1.6mm) ** should not exceed pd-value. not designed to be radiation-resistant. * ** downloaded from: http:///
electrical characteristics (unless otherwise specified, ta=25?c, vcc=12 v, ct=200pf, rt=20 k ) measurement circuit diagram 3/16 item symbol min typ max unit conditions [error amplifier block] input bias current i ib C 0.1 1 a open loop gain av C 85 C db null amp maximum output voltage v oh 2.3 2.5 C v minimum output voltage v ol C 0.7 0.9 v output sink current i oi 0.1 1 C ma v fb =1.25v output source current i oo 40 70 C av fb =1.25v [output block]saturation voltage v sat C 1.0 1.4 v io=30ma leak current i leak CC1 0 a out=35v [control block] ctl on voltage v on 2CC v ctl off voltage v off C C 0.7 v ctl sink current i ctl C5 79 0 av ctl =5v [ whole device ] standby current i stb C01 0 av ctl =0v a verage supply current i cc C 1.2 2.4 ma rt=vref limits v cc v cc fm fb v ref 200pf out dtc ctl non 1k 1k 1k 100k 100k 20k 470pf scp i ref v v null + - a a fig. 1 typical measurement circuit v a a a a a a v v v v not designed to be radiation-resistant. downloaded from: http:///
reference characteristics data (unless otherwise specified, ta=25?c) 4/16 ambient temperature ta [? c] fig.2 reference voltage vs. ambient temperature input voltage vcc [v] fig.5 circuit current input voltage vcc [v] fig.6 reference voltage reference current iref [ma] fig.7 reference voltage vs. output current ambient temperature ta [?c ] input voltage vcc [v] fig.3 switching frequency vs. ambient temperature fig.4 standby current reference voltage vref [v] circuit current icc [ma] reference voltage vref [v] reference voltage vref [v] switching frequency fsw [khz] stand-by current istby [ a] 25?c -40?c 85?c -40?c 25?c control voltage ctl [v] fig.8 control threshold voltage output current out [ma] fig.9 output current capacitance control voltage vctl [v] fig.10 control sink current reference voltage vref [v] output voltage vout [v] control current ictl [ a] 85?c 25?c -40?c 2.562.55 2.54 2.53 2.52 2.51 2.50 2.49 2.48 2.47 2.46 2.45 218216 214 212 210 208 206 204 202 200 0.100.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 3.002.75 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 3.002.75 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 4.003.75 3.50 3.25 3.00 2.75 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 8075 70 65 60 55 50 45 40 35 30 25 20 15 10 50 3.002.75 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 3.002.75 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -40 -20 0 20 40 60 80 -40 -20 0 20 40 60 80 0 4 8 12 16 20 24 28 32 36 0 4 8 12 16 20 24 28 32 36 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.5 0 10 20 30 40 50 60 70 80 90 100 0 4 8 12 16 20 24 28 32 36 0 2 4 6 8 10 12 14 85?c 25?c -40?c 85?c -40?c 25?c 85?c 25?c -40?c 85?c 85?c 25?c -40?c 85?c 25?c -40?c downloaded from: http:///
pin assignment block diagram pin assignment and function fig. 11 pin assignment / block diagram 5/16 14 13 12 11 10 2.5v 1.25v 9 8 non err pwm timer latch vref osc 1/2vref inv vref ctl scp vcc 1234567 dtc rt ct fb out n.c. gnd non1/2vref inv vref ctl scp vcc dtc rt ct fb out n.c. gnd C+ C+ C pin no. pin name function 1 dtc rest period setting voltage input 2 rt external timing resistance 3 ct external timing capacitance 4 fb error amplifier output 5 out pwm output (open collector) 6 n.c. C 7 gnd ground 8 vcc power supply 9 scp external timer latch setting capacitance (ground if not used) 10 ctl control input 11 vref reference voltage output 12 inv inverting input for error amplifier 13 1/2vref 1/2 reference voltage output 14 non non-inverting input for error amplifier downloaded from: http:///
description of operationsvref block the vref block is a block to output a reference voltage of 2.5 v (typ), which is used as the operating power supply for all the internal. the ctl pin is used to turn on/off the reference voltage. furthermore, this reference voltage has a current capacitance of 1 ma (min) or more, from which a high-accuracy reference voltage can be generated through dividing resistance. erramp block the erramp block is an error amplifier to amplify potential between the non and the inv pins and then output a voltage. the fb pin output voltage determines the output pulse duty. when the fb voltage reaches 1.95 v (typ) or more, switching will be off (duty=0%). when the fb voltage reaches 1.45 v (typ) or less, the output npn tr will be full on (duty=100%). osc block the osc block is a block to determine the switching frequency through the rt and the ct pins. rt and ct voltages determine the triangular waveform. timer latch block the timer latch block is an output short circuit protection circuit to detect output short circuit when the output voltage from the fb pin of the error amplifier reaches 1 v (typ) or less. when the fb voltage reaches 1 v (typ) or less, the timer will starts operating to charge the scp pin at a current capacitance of 7 a (typ). when the scp voltage reaches 1.8 v (typ), the latch will be activated to shut down the circuit. pwm/driver block the pwm/driver block is a pwm comparator to determine duty value differences between output from the error amplifier and the oscillator triangular wave. the dtc voltage determines the maximum duty ratio. when the dtc voltage reaches 1.95 v (typ), the switching off is activated. full on will be activated when the dtc voltage reaches 1.45 v (typ). the dtc voltage setting should be made through dividing resistance with the vref block. fig. 12 typical application circuit 6/16 + C err + CC pwm 14 13 12 1 1 10 9 8 1 2 3 4 5 6 7 non vref osc timer latch 1/2vref inv vref ctl scp vcc dtc rt ct fb out n.c. gnd 100pf 33k 20k 20k 30k 90k 30k 500 0.1 f 500 51k 100pf 220pf 1000pf 0.1 f vcc 100 f 100 f 33 h vo 1.25v 2.5v downloaded from: http:///
timing chart . basic operation dt fb dtc fb osc [v] 21 0 5 0 2.5 05 0 5 0 2.5 0 50 2.5 1.25 0 2.51.5 0 1.8 0 vcc [v] ctl [v] out [v] non [v] vref [v] vo [v] non [v] dtc [v] scp [v] fb [v] . when the short circuit protection is activated 7/16 fig. 13 basic operation fig. 14 timing when the short circuit protection is activated downloaded from: http:///
external component setting procedure connecting a resistor and capacitor to the rt pin (pin 2) and the ct pin (pin 3) will set the triangular wave oscillation frequency. the rt determines the charge/discharge current to the capacitor. referring to fig. 18, set rt resistor and the ct capacitor. recommended setting ranges are 5 to 100 k for the ct resistor, 33 to 1000 pf for the ct capacitor, and 20 khz to 800 khz for the oscillation frequency. any setting outside of these ranges may turn off switching, thus impairing the operation guarantee. (3) setting of dtc voltage applying the v dtc voltage to the dtc pin (pin 1) will fix the maximum duty ratio.this will serve to prevent the power transistor (fet) from being full on. fig. 19 shows the relationship between the dtc voltage and the maximum duty ratio. referring to this figure, set the dtc voltage.next, generate the v dtc by dividing the v ref voltage with resistance and then input the v dtc in the dtc pin. furthermore, the maximum duty ratio should be designed so as not to become a maximum duty for the normal use. the following section shows ranges for the normal use. vomax vccmin . step-down voltage ondutymax = 10000 1000 100 10 1 2 10 100 200 rt [k ] fig. 18 rt/ct vs. frequency freq [khz] ta=25?c vcc=12v ct=33pf ct=33pfct=100pf ct=100pfct=200pf ct=200pfct=470pf ct=470pfct=1000pf ct=1000pf ct=33pfct=100pf ct=200pf ct=470pf ct=1000pf 120100 8060 40 20 0 -20 1.4 1.5 2 1.9 1.8 1.7 1.6 v dtc [v] fig. 19 dtc voltage vs. maximum duty ta=25?c vcc=12v fosc=220khz on duty [%] fig. 15 step-down voltage fig.16 step-up voltage fig. 17 inverting voltage r8+r9 r9 vo = x 1.25 [v] r8+r9 r9 vo = x 1.25 [v] r8r9 ( ) vo = 1.25 1C [v ] 8/16 12 14 vo r8r9 err + C . step-down voltage . step-up voltage . inverting voltage reference voltage: 1.25 v 12 14 vo r8r9 err + C reference voltage: 1.25 v 12 14 11 vo (negative) r8r9 err + C reference voltage: 1.25 v vref (1) design of feedback resistance constant (2) setting of oscillation frequency set step-down, step-up, and inverting feedback resistance as shown below. set resistance in the range of 1 k to 330 k . setting the resistance to 1 k or less will result in degraded power efficiency, while setting it to 330 k or more will increase the offset voltage due to the input bias current of 0.1 a (typ) of the error amplifier. vomax C vomin vomax . step-up voltage ondutymax = vomax vomax C vccmin . nverting voltage ondutymax = downloaded from: http:///
(4) setting of soft start time adding a capacitor to the dtc resistance divider will enable the soft start function activation. the soft start function will be required to prevent an excessive increase in the coil current and overshoot of the output voltage, while in startup operation. fig. 20 shows the relationship between the capacitor and the soft start time. referring to this figure, set the capacitor. it is recommended to set the capacitance value in the range of 0.01 to 10 f. setting the capacitance value to 0.01 f or less, may cause overshoot to the output voltage, while setting it to 10 f or more may cause an inverse current in the internal parasitic diode when the power supply is grounded, thus resulting in damage to the internal element.the internal element. since the pnp tr is generally slow in switching, in terms of the sat characteristics , the on/off peak circuit is used as an acceleration circuit. the d1 and the c7 generate an on peak current, while the q1 and the c7 forms an off peak circuit.set pull-up resistance to 510 as a guide at vcc=12 v. it is recommended to set this resistance in the range of 100 k to 10 k . in order to make adjustment of the r6 and r7, however, pay attention of the points listed in table below. take 1000 pf as a guide for the c7 setting. if the on/off peak currents are inadequate, increase the c7 capacitance value. it is recommended to set capacitance values in the range of 100 pf to 10000 pf. setting the capacitance value to 10000 pf or more may increase the peak current and degrade the power efficiency. 9/16 1.00e+021.00e+01 1.00e+00 1.00eC01 c dtc [f] fig. 20 soft start capacitance vs. delay time t soft [msec] ta=25?c vcc=12v vo=5v fosc=220khz l=33 h c out =100 f r1=20kr2=33k 1.00eC09 1.00eC08 1.00eC07 1.00eC06 1.00eC05 fig. 21 on/off peak circuit no. 12 3 4 item efficiency tr turn on / turn off switching frequency load current capacitance to reduce r6 degraded faster turn off increasable degraded to reduce r7 degraded faster turn off increasable degraded vcc c5 c6 c7 r6 r7 d1 q2 q1 l d2 out downloaded from: http:///
(6) phase compensation phase compensation setting procedure the phase compensation setting procedure varies with the selection of output capacitors used for dc/dc converter application. in this connection, the following section describes the procedure by classifying into the two types. furthermore, the application stability conditions are described in the description section. 1. application stability conditions 2. for output capacitors having high esr, such as electrolytic capacitor 3. for output capacitors having low esr, such as ceramic capacitor or os-con 1. application stability conditions the following section shows the stability conditions of negative feedback system. . dsc, dvd, printer, dvd/dvd recorder, and other consumer productsat a 1 (0-db) gain, the phase delay is 150? or less (i.e., the phase margin is 30? or more). furthermore, since the dc/dc converter application is sampled according to the switching frequency, gbw of the overall system should be set to 1/10 or less of the switching frequency. the following section summarizes the targeted characteristics of this application. . dsc, dvd, printer, dvd/dvd recorder, and other consumer productsat a 1 (0-db) gain, the phase delay is 150? or less (i.e., the phase margin is 30? or more). . dsc, dvd, printer, dvd/dvd recorder, and other consumer productsthe gbw (i.e., frequency at 0-db gain) for this occasion is 1/10 or less of the switching frequency. in other words, the responsiveness is determined with restrictions on the gbw. consequently, in order to upgrade the responsiveness, higher switching frequency should be provided. in order to ensure the stability through the phase compensation, a secondary phase delay ( C 180?) resulting from lc resonance should be canceled with a secondary phase lead (i.e., through inserting two phase leads).furthermore, the gbw (i.e., frequency at 1-db gain) is determined according to phase compensation capacitance to be provided for the error amplifier. consequently, in order to reduce the gbw, increase the capacitance value. since the error amplifier is provided with (sun) or (mon) phase compensation, the low pass filter is applied. in the case of the dc/dc converter application, the r becomes a parallel resistance of the feedback resistance. fig. 22 typical integrator characteristics 10/16 +C feedback a r c fb (1) typical (sun) integrator (low pass filter) (2) open loop characteristics of (mon) integrator a 0 0 C90 C180 C90? C180? phase margin gain [db] phase [?] (a) (a) point(b) point ff C20db/decade gbw(b) fa= fb=gbw= [hz] [hz] downloaded from: http:///
2. for output capacitors having high esr, such as aluminum electrolytic capacitor for output capacitors having high esr (i.e., several ohms), the phase compensation setting procedure becomes comparatively simple. since the dc/dc converter application has a lc resonant circuit attached to the output, a C 180? phase-delay occurs in that area. if esr component is present there, however, a +90? phase-lead occurs to shift the phase delay to C 90?. since the phase delay is desired to set within 150?, this is a very effective method but has a demerit to increase the ripple component of the output voltage. * same for the phase compensation of inverting and step-up voltages according to changes in phase characteristics due to the esr, only one phase lead should be inserted. for this phaselead, select either of the methods shown below: to cancel the lc resonance, phase lead frequency should be set close to the lc resonant frequency. y. fig. 23 dc/dc converter output application fig. 24 typical phase compensation circuit 11/16 (3) lc resonant circuit (4) with esr provided vo vcc at this resonance point, a -180? phase-delay occurs. fz= [hz] l c vo vcc : resonance point f z = [hz] l c f esr = r esr [hz] a C 90? phase-delay occurs. : phase lead + C a fb (5) insert feedback resistance in the c. vo phase lead: fz= [hz] c1 c2 r1r2 + C a fb (6) insert the r3 in integrator. vo phase lead: fz= [hz] c2 r1 r3 downloaded from: http:///
3. for output capacitors having low esr, such as a ceramic capacitor or os-con in order to use capacitors having low esr (i.e., several tens of mw), two phase-leads should be inserted so that a C 180? phase-dela y, due to lc resonance, will be compensated. the following section shows a typical phase compensation procedure. for the settings of phase lead frequency, insert both of the phase leads close to the lc resonant frequency. phase compensation on the bd9300f/fv for bd9300f/fv, since the error amplifier input is inverted to the normal input, the phase compensation procedure is slightly different. (the bd9300f/fv returns feedback to the non pin.) the bd9300f/fv feeds back on the + side input and returns the phase compensation on the - side input. consequently, resistance of the resistance divider being used to determine the reference voltage has influence on the frequency characteristics. (the bd9300f/fv has a 1/2 vref pin to divide resistance by 100 k .) the following section shows the phase characteristics.as a result, inserting a phase compensation capacitor will cause phase lead component. if any further phase lead is required, add a capacitor in parallel with the r1. + C a fb vo c r1 r2 100k 100 k internal reg 2.5v the bd9300 returns feedback to the + side of the error amplifier. fig. 25 typical circuit after secondary compensation circuit fig. 26 typical circuit after phase compensation on bd9300f/fv 12/16 . phase compensation with secondary phase lead + C a fb vo phase lead: fz 1 = [hz] phase lead: fz 2 = [hz] c1 c2 r1 r3 r2 inv lc resonant frequency: fr= [hz] primary phase delay: fp = [hz], where a is approximately 80 db. 1 100k 2 phase lead: fz = [hz] 1 100k 2 downloaded from: http:///
equivalent circuit (1) dtc(3) ct (4) fb (5) out (9) scp (10) ctl (12) inv (13) 1/2 vref (14) non v ref v ref 100k 100k 1/2v ref dtc v ref v ref 1k rt v ref 100 inv v ref v ref 1k non v ref v ref 1k scp v ref v ref 500 out 2k ctl v cc 75k 50k ct v ref v ref 100 fb v ref v ref 100k 17.8k 500 13/16 downloaded from: http:///
cautions on use 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2) gnd potential ground-gnd potential should maintain at the minimum ground voltage level. furthermore, no terminals should be lower than the gnd potential voltage including an electric transients. 3) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) inter-pin shorts and mounting errors use caution when positioning the ic for mounting on printed circuit boards. the ic may be damaged if there is any connection error or if positive and ground power supply terminals are reversed. the ic may also be damaged if pins are shorted together or are shorted to other circuits power lines. 5) operation in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic field as doing so may cause the ic to malfunction. 6) testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to, or removing it from a jig or fixture, during the inspection process. ground the ic during assembly steps as an antistatic measure. use similar precaution when transporting and storing the ic. 7) ic pin input this monolithic ic contains p+ isolation and p substrate layers between adjacent elements to keep them isolated. p?n junctions are formed at the intersection of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p?n junction operates as a parasitic diode. when pin b > gnd > pin a, the p?n junction operates as a parasitic transisto r. parasitic diodes can occur inevitably in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. 8) ground wiring pattern the power supply and ground lines must be as short and thick as possible to reduce line impedance. fluctuating voltage on the power ground line may damage the device. 14/16 fig. 28 typical simple construction of monolithic ic resistor (pin a) (pin b) player p laye r (pin b) (pin a) parasitic element parasitic element parasitic element parasitic element gnd gnd b b c n n n n n n p p + p + p + p + p n e e c gnd gnd gnd transistor (npn) downloaded from: http:///
15/16 selection of order typepackage specifications b d 9 3 0 0 f v C e2 product name package fv:ssop-b14 f :sop14 package/forming specificationse2 : embossed carrier tape fig. 29 thermal derating characteristics bd9300fv bd9300f 0 25 50 75 100 125 ta [ ? c] 400350 300 200 100 (2)(1) 0 25 50 75 100 125 ta [ ?c ] [mw] pd [mw] pd 400300 100 (2)(1) (1) ic only(2) on 70 x 70 x 1.6mm board (1) ic only(2) on 70 x 70 x 1.6mm board sop14 ssop-b14 package styleqty per package packaging direction embossed carrier tape2500pcs e2 (when holding a reel by left hand and pulling out the tape byright hand, no. 1 pin appears in the upper left of the reel.) reel no. 1 pin pulling-out side *orders are available in complete units only. package styleqty per package packaging direction embossed carrier tape2500pcs e2 (when holding a reel by left hand and pulling out the tape byright hand, no. 1 pin appears in the upper left of the reel.) reel no. 1 pin pulling-out side *orders are available in complete units only. derating curve downloaded from: http:///
catalog no.08t677a '08.9 rohm ? downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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